MPPO Waffle Pack Chip Trays
Designed for bare die and small chip packaging, our waffle pack trays ensure secure, static-safe storage in precision grid arrays.
The tray can carrier component also provides comprehensive protection for transit and transport, and provides great convenience. All kinds of specifications and various colors can be realized, and we provide one-stop service from design to production to packaging.
The use of anti-static tray storage for electronic components can effectively avoid the short-circuit phenomenon. Because the product is prone to friction in the process of placement and transportation, if there is some static electricity on the circuit board of the product, it is easy to lead to a short circuit of the circuit board, affecting the quality of the product, and may even cause damage
HN21013-1 Detail Information:
As for HN21013-1, usually used for loading small chips or components less than 8.5mm, the matrix quantity is 9*9=81PCS per tray, carrying a large number of chips in a small volume. At the same time, the products can match the corresponding accessories such as cover, clip, and Tyvek paper of the existing series, and the complete package is easier to transfer, transport, and store the products.
Technical Parameters:
| Brand | Hiner-pack | Outline Line Size | 101.57*101.57*3mm |
| Model | HN21013-1 | Package Type | IC Parts |
| Cavity Size | 8.5*8.5mm | Matrix QTY | 9*9=81PCS |
| Material | ABS | Flatness | MAX 0.3mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
| Item Material | ABS / PC / MPPO / PPE... acceptable |
| OEM&ODM | YES |
| Item Color | Can be customized |
| Feature | Durable; Reusable; Rcofriendly; Biodegradable |
| Sample | A. The free samples: chosen from existing products. |
| B. customized samples as per your design/demand |
| MOQ | 500pcs. |
| Packing | Carton or as per the customer's request |
| Delivery time | Usually 8-10 working days, depending on order quantity |
| Terms of payment | Products: 100% prepayment.
Mold: 50% T/T deposit, 50% balance after sample confirmation |
Application:
Suitable for Wafer Die / Bar / Chips / PCBA module component;
Electronic component packaging and optical device packaging. Packaging:
Packaging Details: Packing according to the customer's specified size.
Advantages:
1. More than 10 years of export experience.
2. With professional engineers and efficient management.
3. Short delivery time and good quality.
4. Support small batch production in the first batch.
5. Professional sales within 24 hours efficient reply.
6. The factory has ISO certification, and the products comply with the RoHS standard.
7. Our products are exported to the United States, Germany, the UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, with service or cost performance being well recognized.
FAQ:
Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value, and all samples shipping costs are normally is by collected or as agreed.
Q: What kind of income can you do?
A: We could support to do Ex works, FOB, CNF, CIF, CFR, DDU, DAP, etc., and other incoterm as agreed.
Q: What method you can use to ship the goods?
A: By sea, by air, by express, by mail, post according to customer order quantity and volume.
